Jingbo Hou

Associate, Hong Kong SAR



Jingbo Hou is an associate in the Mergers & Acquisitions and Private Equity practice, based in Hong Kong.

Her experience includes advising private equity and multinational corporate clients on cross-border private and public acquisitions, fund establishment and capital raising, platform co-investments, public takeovers and joint ventures.

Bars and Courts
Registered Foreign Lawyer, Hong Kong
New York State Bar
Columbia Law School
Master of Law
University College London
Bachelor's Degree
Jilin University


Jingbo's experience includes representation of:

  • BBPOS Holdings Limited and BBPOS International Limited, sellers and designers of mobile payment POS machines, in a share and asset sale of the group's business to Stripe, Inc., an industry leader in payment processing and financial services.
  • Celestica Inc., a Canadian-listed multinational electronics manufacturing services business, in its US$306 million acquisition of PCI Private Limited, a Singaporean-based South East Asian electronics manufacturing and service business, from Platinum Equity.
  • Nestlé S.A., in the sale of its Yinlu congee business in the mainland China.
  • The Carlyle Group in its US$490 million acquisition of a strategic 20 percent stake in Piramal Pharma, the pharmaceutical division of Piramal Enterprises Limited, one of India's leading diversified companies, with a presence in financial services, information management and pharmaceuticals.
  • CCAC, a SPAC of CITIC Capital, in its US$1.4 billion business combination with Quanergy Systems Inc., a technology company in the LiDAR industry.
  • CMC's Series C equity financing in an e-commerce platform.
  • C Venture's Series A equity financing in Yum Delight, a consumer products manufacturer.
  • HNA Group in its US$675 million acquisition of Pactera Technology International Ltd., an information technology consulting business, from Blackstone.
  • Suzhou Dongshan Precision Manufacturing Co., Ltd. ("DSBJ"), one of the largest suppliers of precision sheet metal components headquartered in Suzhou, China:
    • in its US$293 million acquisition of the non-U.S. based printed circuit board business from NASDAQ-listed Flex Ltd; and,
    • in its $610 million acquisition of Multi-Fineline Electronix, Inc., an Irvine, CA based global provider of high-quality, technologically advanced flexible printed circuits and assemblies.